![]() The new DSP incorporates a neural processing unit (NPU) with dedicated Tensor-cores that can execute up to 7 trillion operations per second in conjunction with the CPU and GPU. The Hexagon 690 DSP has undergone the most revisions of that which Qualcomm has integrated into the Snapdragon 855. The Wi-Fi modem can utilise the 60 GHz mmWave band for up to 10 Gbit/s internet speeds. ![]() Qualcomm has also improved the integrated Wi-Fi modem, which is Wi-Fi 6-ready, has 8x8 Sounding and supports up to 802.11 ay Wi-Fi. The Snapdragon 855 can be configured with the company’s new X50 5G modem too. The SoC also integrates the new X24 LTE modem that Qualcomm promises will deliver up to 2 Gbit/s maximum download speed over LTE Cat.20 and up to 316 Mbit/s upload speeds. Qualcomm praises the Snapdragon 855’s ability to maintain its performance when faced with sustained load, beating the Apple A12 Bionic SoC and the HiSilicon Kirin 980. The new SoC should have up to 45% faster single-core performance and 35% multi-core performance than its predecessor. The higher ‘Prime Core’ clock speed should provide significantly better single core performance than the Snapdragon 845, but we suspect that the Snapdragon 855 will fall short of the Apple A12 Bionic. ![]() These are complemented by four power-saving ARM Cortex-A55 cores that clock up to a maximum of 1.8 GHz. The SoC integrates a fast ‘Prime Core’ that clocks up to 2.84 GHz and three further fast ARM Cortex-A76 performance cores, which can reach up to 2.42 GHz. The Qualcomm Snapdragon 855 Mobile Platform is a high-end smartphone and tablet SoC that Qualcomm announced in December 2018. Qualcomm Snapdragon 855 ► remove from comparison ![]()
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